In this context, Ge NWs are particularly promising, owing to the smaller bandgap and the larger exciton Bohr radius of Ge, which provide quantum confinement effects at larger nanowire sizes compared to Si [7]. One major hurdle for technological application of NWs is to develop a growth method combining synthesis and assembly in a single step, hopefully also being compatible Rabusertib order with traditional planar device architecture. Ge NWs are usually grown by vapor-liquid-solid (VLS) mechanism [8–10]. In this process,

the metal seed, which is required as catalyst, is left in the final wire structure, and this can degrade the performance of nanowire-based devices. In this paper, we outline a metal-free fabrication route for in-plane Ge NWs on Ge(001) substrates. We will show that, by exploiting the intrinsic polishing-induced defects of standard Ge wafers, micrometer-length wires can be grown by physical vapor deposition (PVD) in an ultra-high-vacuum (UHV) environment. We will also show that, under epitaxial strain induced by subsequent Si deposition, the shape of the wires can be tailored, resulting in a progressive transformation of the wires in SiGe faceted quantum dots. This shape transition, which has been described by finite element (FE) simulations

of continuous elasticity, gives hints on the equilibrium shape of nanocrystals in the presence of tensile epitaxial strain. Methods All experiments are carried out by CX-6258 cost using commercial epi-ready, prime-grade polished Ge(001) wafers (Sb-doped with resistivity of 7 to 9 Ω cm). The samples were outgassed in UHV (p < 5 × 10-11 mbar) for several hours at 300°C. For NW synthesis, Ge(001) substrates are Adenosine triphosphate prepared by a mild sputtering/annealing procedure: Surface cleaning is performed by 4 cycles of Ar sputtering (830 V, 20 min) and annealing at 830°C by direct current heating. Sputtering is performed at normal incidence by a differentially pumped ion gun at a base pressure of 2 × 10-7 mbar.

Ge and Si are deposited at 500°C by PVD using e-beam evaporators in UHV. The growth is monitored in situ by scanning tunneling microscopy (STM; Omicron VT, Omicron NanoTechnology GmbH, Taunusstein, Germany). Ex situ morphological characterization is performed by atomic force microscopy (AFM) in tapping mode (Asylum Research Cypher, Santa Barbara, CA, USA), optical (Leica DM2700M, Leica Microsystems, Wetzlar, Germany), field emission scanning electron microscopy (FE-SEM; Zeiss-SIGMA, Carl Zeiss, Inc., Oberkochen, Germany), and transmission electron microscopy (TEM; JEOL 2100 at 200 kV, JEOL Ltd., Akishima-shi, Japan). The samples for TEM characterization are prepared by ‘lift out’ technique using a focus ion beam (FIB) with Ga ions (FEI Quanta 3D, FEI, Hillsboro, OR, USA). A layer of FIB-deposited see more platinum is placed over the area of interest to prevent milling from damaging the surface of the TEM specimen cross-section.